The topic of the symposium includes, but is not limited to, following sessions:

Emerging Technologies, Devices and Circuits

Location

  • Advances on CMOS, SiGe BiCMOS and III/V compound semiconductors devices and technologies.
  • Advanced materials and processing technologies
  • Advanced transistor and interconnect structures
  • Three-dimensional (3D) integration
  • Advanced memory devices and circuits
  • Simulation and modeling of advanced processes, devices, and circuits
  • Power semiconductor technologies and circuits
  • Testing and Yield Enhancement
  • Fabrication and Assembly
  • Bio & Medical devices, Bio-medical imagers
  • Bio-electronic integrated systems

VLSI and Analog VLSI Design Automation

Location

  • Techniques, Simulation Techniques, AHDL, Analog IP
  • Simulation and modeling of advanced processes, devices, and circuits
  • EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • Digital circuit techniques, I/O and inter-chip communication, Reconfigurable digital circuits, Clocking, Arithmetic building blocks, Microprocessors, DSPs, Gigabit serial links, Clock and data recovery, Equalization, Memory interfacing, Bus interfacing, Multi-rate ICs.
  • System-on-Chip/Package (SoC/SiP)
  • Low-leakage SRAMs and logic circuits
  • Resistive memories, High-efficiency power circuits

Analog/RF and Mixed-Signal Integrated Circuits and Systems

Location

  • Amplifiers, Filters, Comparators, Oscillators, Multipliers, PLL, Voltage/Current References, Sample-And-Hold Circuits, A/D and D/A Converters, High speed IO Interface, DC-DC converters.
  • RF/IF/analog baseband circuits, LNAs, Mixers, Power Amplifiers, VCO, IF amplifiers, Power detectors.
  • High-efficiency power circuits

Embedded Systems and Applications

Location

  • Software Architecture, Development, and Design
  • Processors and Programmable Devices
  • Hardware: Design, I/O, and Interfacing
  • Embedded Systems Engineering
  • Real-Time Operating Systems
  • Embedded Applications, Wireless sensor networks

Analog Signal and Information Processing Applications

Location

  • Telecommunication, Multimedia, Automotive Electronics, Biomedical Electronics, Consumer Electronics, Neural Networks, Sensing and Sensor Networks, Space and Military Electronics

MEMS

Location

  • MEMS/NEMS/sensors/bio-sensors
  • MEMS and Applications
  • Sensor subsystems and interfaces, Accelerometers, Temperature sensing, Imaging and smart imaging chips, AMOLED, MEMs subsystems, RF MEMs.
  • Bio-MEMs integrated systems

Advanced Packaging Technology

Location

(A special session)