Original papers are solicited in the following subject areas:

  • Advanced materials and processing technologies
  • Advanced transistor and interconnect structures
  • Three-dimensional (3D) integration
  • Variation-tolerant designs
  • Process and design techniques for soft errors, plasma-induced damage, and reliability
  • Advanced memory devices and circuits
  • RF, analog, mixed signal, and I/O circuits for future technology generations
  • Simulation and modeling of advanced processes, devices, and circuits
  • EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • Design for manufacturing, yield, and test
  • System-on-Chip (SoC) and system-in-package (SiP) design integration
  • Power semiconductor technologies and circuits
  • Emerging technologies and circuits